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K4B2G0446D Datasheet, PDF (23/64 Pages) Samsung semiconductor – 2Gb D-die DDR3L SDRAM
K4B2G0446D
K4B2G0846D
datasheet
Rev. 1.01
DDR3L SDRAM
9.6.2 Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications
[ Table 23 ] AC overshoot/undershoot specification for Clock, Data, Strobe and Mask (DQ, DQS, DQS, DM, CK, CK)
Parameter
Specification
Unit
DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600
1.35V
Maximum peak amplitude allowed for overshoot area (See Figure 10)
TBD
TBD
TBD
TBD
V
Maximum peak amplitude allowed for undershoot area (See Figure 10)
TBD
TBD
TBD
TBD
V
Maximum overshoot area above VDDQ (See Figure 10)
Maximum undershoot area below VSSQ (See Figure 10)
TBD
TBD
1.5V
TBD
TBD
TBD
TBD
TBD
TBD
V-ns
V-ns
Maximum peak amplitude allowed for overshoot area (See Figure 10)
0.4V
0.4V
0.4V
0.4V
V
Maximum peak amplitude allowed for undershoot area (See Figure 10)
0.4V
0.4V
0.4V
0.4V
V
Maximum overshoot area above VDDQ (See Figure 10)
0.25V-ns
0.19V-ns
0.15V-ns
0.13V-ns
V-ns
Maximum undershoot area below VSSQ (See Figure 10)
0.25V-ns
0.19V-ns
0.15V-ns
0.13V-ns
V-ns
Maximum Amplitude
Overshoot Area
Volts
(V)
VDDQ
VSSQ
Maximum Amplitude
Undershoot Area
Time (ns)
Figure 10. Clock, Data, Strobe and Mask Overshoot and Undershoot Definition
9.7 34ohm Output Driver DC Electrical Characteristics
A functional representation of the output buffer is shown below. Output driver impedance RON is defined by the value of external reference resistor RZQ
as follows:
RON34 = RZQ/7 (Nominal 34.3ohms +/- 10% with nominal RZQ=240ohm)
The individual Pull-up and Pull-down resistors (RONpu and RONpd) are defined as follows
RONpu =
VDDQ-VOUT
l Iout l
under the condition that RONpd is turned off
RONpd =
VOUT
l Iout l
under the condition that RONpu is turned off
Output Driver
VDDQ
Ipu
To
other
circuity
RON
Pu
RON
Pd
Ipd
DQ
Iout
Vout
VSSQ
Figure 11. Output Driver : Definition of Voltages and Currents
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