RL78G12_15 Datasheet, PDF (3/110 Pages) Renesas Technology Corp – RENESAS MCU

RL78/G12
1. OUTLINE
1.2 List of Part Numbers
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Figure 1-1. Part Number, Memory Size, and Package of RL78/G12
Part No.
R 5 F 1 0 2 A A A x x x S P #V0
Packaging specifications:
#U0 : Tray (HWQFN)
#V0 : Tray (LSSOP30), Tube (LSSOP20)
#W0: Embossed Tape (HWQFN)
#X0 : Embossed Tape (LSSOP30, LSSOP20)
Package type:
SP : LSSOP, 0.65 mm pitch
NA : HWQFN, 0.50 mm pitch
ROM number (Omitted with blank products)
Classification:
A : Consumer applications, TA = -40˚C to +85˚C
D : Industrial applications, T_A = -40˚C to +85˚C
G : Industrial applications, T_A = -40˚C to +105˚C
ROM capacity:
6 : 2 KB
7 : 4 KB
8 : 8 KB
9 : 12 KB
A : 16 KB
Pin count:
6 : 20-pin
7 : 24-pin
A : 30-pin
RL78/G12 group
102^{Note 1}
103^{Notes 1, 2}
Memory type:
F : Flash memory
Renesas MCU
Renesas semiconductor product
Notes 1.
2.
For details about the differences between the R5F102 products and the R5F103 products of RL78/G12,
see 1.3 Differences between the R5F102 Products and the R5F103 Products.
Products only for "A: Consumer applications (TA = -40 to +85°C)" and "D: Industrial applications (TA = -40 to
+85°C)"
R01DS0193EJ0200 Rev.2.00
Sep 06, 2013
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