PDI1394P21 Datasheet, PDF (11/28 Pages) NXP Semiconductors – 3-port physical layer interface

Philips Semiconductors
3-port physical layer interface
Objective specification
PDI1394P21
13.0 THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
TEST CONDITION
RΘjA Junction-to-free-air thermal resistance Board mounted, no air flow
LIMITS
UNIT
MIN
TYP MAX
TBD
°C/W
14.0 AC CHARACTERISTICS
SYMBOL
PARAMETER
Transmit jitter
Transmit skew
t_r
TPA, TPB differential output voltage rise time
t_f
TPA, TPB differential output voltage fall time
t_SU
Setup time, CTL0, CTL1, D1–D7, LREQ to SYSCLK
t_H
Hold time, CTL0, CTL1, D1–D7, LREQ after SYSCLK
t_D
Delay time SYSCLK to CTL0, CTL1, D1–D7
CONDITION
TPA, TPB
Between TPA and TPB
10% to 90%; At 1394 connector
90% to 10%; At 1394 connector
50% to 50%; See Figure 2
50% to 50%; See Figure 2
50% to 50%; See Figure 3
MIN TYP MAX UNIT
0.15
ns
0.10
ns
0.5
1.2
ns
0.5
1.2
ns
5
ns
0
ns
0.5
11
ns
15.0 TIMING WAVEFORMS
TPAn+
TPBn+
56 Ω
TPAn–
TPBn–
SV01098
Figure 1. Test load diagram
SYSCLK
t_D
Dn, CTLn, LREQ
SV01100
Figure 3. Dn, CTLn, output delay relative to SYSCLK
SYSCLK
Dn, CTLn, LREQ
t_SU
t_H
SV01099
Figure 2. Dn, CTLn, LREQ input setup and hold times
1999 Jul 09
11