MT40A256M16GE-075E Datasheet, PDF (280/365 Pages) Micron Technology – Temperature controlled refresh (TCR)

4Gb: x4, x8, x16 DDR4 SDRAM
Electrical Characteristics – AC and DC Differential Input Meas-
urement Levels
Figure 219: Differential Input Slew Rate Definition for CK_t, CK_c
TR_diff
V_IH,diff,min
0
V_IL,diff,max
TF_diff
CK Differential Input Cross Point Voltage
To guarantee tight setup and hold times as well as output skew parameters with respect
to clock and strobe, each cross point voltage of differential input signal CK_t, CK_c must
meet the requirements shown below. The differential input cross point voltage V_IX(CK) is
measured from the actual cross point of true and complement signals to the midlevel
between V_DD and V_SS.
Figure 220: V_IX(CK) Definition
V_DD
CK_c
V_IX(CK)
V_SEH
V_IX(CK)
V_SEL
V_IX(CK)
V_DD/2
CK_t
V_SS
09005aef84af6dd0
4gb_ddr4_dram.pdf - Rev. G 1/17 EN
280
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