PIC18F2525_08 Datasheet, PDF (334/412 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology

PIC18F2525/2620/4525/4620
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2525/2620/4525/4620 (Industrial)
PIC18LF2525/2620/4525/4620 (Industrial) (Continued)
PIC18LF2525/2620/4525/4620
(Industrial)
PIC18F2525/2620/4525/4620
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Legend:
Note 1:
2:
3:
4:
Device
Typ Max Units
Conditions
Supply Current (IDD)⁽²⁾
PIC18LFX525/X620 10 25 μA
-40°C⁽³⁾
11 21 μA
+25°C
VDD = 2.0V
12 25 μA
PIC18LFX525/X620 42 57 μA
33 45 μA
29 45 μA
All devices 105 150 μA
+85°C
-40°C⁽³⁾
+25°C
+85°C
-40°C⁽³⁾
VDD = 3.0V
FOSC = 32 kHz⁽³⁾
(SEC_RUN mode,
Timer1 as clock)
81 130 μA
+25°C
VDD = 5.0V
67 130 μA
PIC18LFX525/X620 3.0 12 μA
+85°C
-40°C⁽³⁾
3.0 6 μA
+25°C
VDD = 2.0V
3.7 10 μA
PIC18LFX525/X620 5.0 15 μA
5.4 10 μA
6.3 15 μA
All devices 8.5 25 μA
+85°C
-40°C⁽³⁾
+25°C
+85°C
-40°C⁽³⁾
VDD = 3.0V
FOSC = 32 kHz⁽³⁾
(SEC_IDLE mode,
Timer1 as clock)
9.0 20 μA
+25°C
VDD = 5.0V
10.5 30 μA
+85°C
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.
When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
DS39626E-page 332
© 2008 Microchip Technology Inc.