PIC18F2525_08 Datasheet, PDF (330/412 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology

PIC18F2525/2620/4525/4620
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2525/2620/4525/4620 (Industrial)
PIC18LF2525/2620/4525/4620 (Industrial) (Continued)
PIC18LF2525/2620/4525/4620
(Industrial)
PIC18F2525/2620/4525/4620
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Legend:
Note 1:
2:
3:
4:
Device
Typ Max Units
Conditions
Supply Current (IDD)⁽²⁾
PIC18LFX525/X620 165 250 μA
-40°C
175 250 μA
+25°C
VDD = 2.0V
190 270 μA
+85°C
PIC18LFX525/X620 250 360 μA
270 360 μA
290 380 μA
All devices 500 700 μA
-40°C
+25°C
+85°C
-40°C
VDD = 3.0V
FOSC = 1 MHz
(RC_IDLE mode,
INTOSC source)
520 700 μA
550 700 μA
+25°C
+85°C
VDD = 5.0V
Extended devices only 0.6 1 mA
+125°C
PIC18LFX525/X620 340 500 μA
-40°C
350 500 μA
+25°C
VDD = 2.0V
360 500 μA
+85°C
PIC18LFX525/X620 520 800 μA
540 800 μA
580 850 μA
All devices 1.0 1.6 mA
-40°C
+25°C
+85°C
-40°C
VDD = 3.0V
FOSC = 4 MHz
(RC_IDLE mode,
INTOSC source)
1.1 1.4 mA
1.1 1.4 mA
+25°C
+85°C
VDD = 5.0V
Extended devices only 1.1 2.0 mA
+125°C
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.
When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
DS39626E-page 328
© 2008 Microchip Technology Inc.