PIC18F2525_08 Datasheet, PDF (25/412 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology

PIC18F2525/2620/4525/4620
2.0 OSCILLATOR
CONFIGURATIONS
2.1 Oscillator Types
PIC18F2525/2620/4525/4620 devices can be operated
in ten different oscillator modes. The user can program
the Configuration bits, FOSC3:FOSC0, in Configuration
Register 1H to select one of these ten modes:
1. LP
Low-Power Crystal
2. XT
Crystal/Resonator
3. HS
High-Speed Crystal/Resonator
4. HSPLL High-Speed Crystal/Resonator
with PLL Enabled
5. RC
External Resistor/Capacitor with
FOSC/4 Output on RA6
6. RCIO External Resistor/Capacitor with I/O
on RA6
7. INTIO1 Internal Oscillator with FOSC/4 Output
on RA6 and I/O on RA7
8. INTIO2 Internal Oscillator with I/O on RA6
and RA7
9. EC
External Clock with FOSC/4 Output
10. ECIO External Clock with I/O on RA6
2.2 Crystal Oscillator/Ceramic
Resonators
In XT, LP, HS or HSPLL Oscillator modes, a crystal or
ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation. Figure 2-1 shows
the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
Note:
Use of a series cut crystal may give a fre-
quency out of the crystal manufacturer’s
specifications.
FIGURE 2-1:
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, LP, HS OR HSPLL
CONFIGURATION)
C1⁽¹⁾
OSC1
XTAL
RF⁽³⁾
To
Internal
Logic
RS⁽²⁾
C2⁽¹⁾
OSC2
Sleep
PIC18FXXXX
Note 1: See Table 2-1 and Table 2-2 for initial values of
C1 and C2.
2: A series resistor (RS) may be required for AT
strip cut crystals.
3: RF varies with the oscillator mode chosen.
TABLE 2-1: CAPACITOR SELECTION FOR
CERAMIC RESONATORS
Typical Capacitor Values Used:
Mode
Freq
OSC1
OSC2
XT
3.58 MHz
4.19 MHz
4 MHz
4 MHz
15 pF
15 pF
30 pF
50 pF
15 pF
15 pF
30 pF
50 pF
Capacitor values are for design guidance only.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
VDD and temperature range for the application.
See the notes following Table 2-2 for additional
information.
© 2008 Microchip Technology Inc.
DS39626E-page 23