PIC18LF4610T-I Datasheet, PDF (319/376 Pages) Microchip Technology – 28/40/44-Pin Flash Microcontrollers

PIC18F2X1X/4X1X
25.2 DC Characteristics: Power-Down and Supply Current
PIC18F2X1X/4X1X (Industrial)
PIC18LF2X1X/4X1X (Industrial) (Continued)
PIC18LF2X1X/4X1X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
PIC18F2X1X/4X1X
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
ParamNo.
Device
Typ Max Units
Conditions
Legend:
Note 1:
2:
3:
4:
5:
Supply Current (IDD)^(2,3)
PIC18LF2X1X/4X1X 250 500 μA
-40°C
260 500 μA
+25°C
VDD = 2.0V
250 500 μA
+85°C
PIC18LF2X1X/4X1X 550 650 μA
480 650 μA
460 650 μA
All devices 1.2 1.6 mA
-40°C
+25°C
+85°C
-40°C
VDD = 3.0V
FOSC = 1 MHZ
(PRI_RUN,
EC oscillator)
1.1 1.5 mA
1.0 1.4 mA
+25°C
+85°C
VDD = 5.0V
Extended devices only 1.0 3.5 mA
+125°C
PIC18LF2X1X/4X1X 0.72 2.0 mA
-40°C
0.74 2.0 mA
+25°C
VDD = 2.0V
0.74 2.0 mA
+85°C
PIC18LF2X1X/4X1X 1.3 3.0 mA
1.3 3.0 mA
1.3 3.0 mA
All devices 2.7 6.0 mA
-40°C
+25°C
+85°C
-40°C
VDD = 3.0V
FOSC = 4 MHz
(PRI_RUN,
EC oscillator)
2.6 6.0 mA
2.5 6.0 mA
+25°C
+85°C
VDD = 5.0V
Extended devices only 2.6 7.0 mA
+125°C
Extended devices only 8.4 21 mA
11 28 mA
+125°C
+125°C
VDD = 4.2V
VDD = 5.0V
FOSC = 25 MHz
(PRI_RUN,
EC oscillator)
All devices 15 35 mA
-40°C
16 35 mA
16 35 mA
All devices 21 40 mA
21 40 mA
+25°C
+85°C
-40°C
+25°C
VDD = 4.2V
VDD = 5.0V
FOSC = 40 MHZ
(PRI_RUN,
EC oscillator)
21 40 mA
+85°C
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
For RC oscillator configurations, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
Low-power Timer1 oscillator selected.
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
© 2009 Microchip Technology Inc.
DS39636D-page 321