PIC24HJ12GP201 Datasheet, PDF (222/234 Pages) Microchip Technology – High-Performance, 16-Bit Microcontrollers

PIC24HJ12GP201/202
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
NOTE 1
E
E1
1 23
e
b
α
h
h
c
A
A2
φ
β
A1
L
L1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Units
Dimension Limits
N
e
A
A2
MILLIMETERS
MIN
NOM
MAX
18
1.27 BSC
–
–
2.65
2.05
–
–
Standoff §
Overall Width
Molded Package Width
A1
0.10
–
0.30
E
10.30 BSC
E1
7.50 BSC
Overall Length
Chamfer (optional)
Foot Length
D
11.55 BSC
h
0.25
–
0.75
L
0.40
–
1.27
Footprint
Foot Angle
Lead Thickness
L1
1.40 REF
φ
0°
–
8°
c
0.20
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Notes:
Mold Draft Angle Bottom
β
5°
–
15°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-051B
DS70282B-page 220
Preliminary
© 2007 Microchip Technology Inc.