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PIC32MX320F032H_11 Datasheet, PDF (208/214 Pages) Microchip Technology – High-Performance, General Purpose and USB, 32-bit Flash Microcontrollers
PIC32MX3XX/4XX
TABLE A-3: MAJOR SECTION UPDATES (CONTINUED)
Section Name
Update Description
Section 29.0 “Electrical
Characteristics”
Added the new V-Temp temperature range (-40ºC to +105ºC) to the
heading of all specification tables.
Updated the Ambient temperature under bias, updated the Voltage on
any 5V tolerant pin with respect to VSS when VDD < 2.3V, and added
Voltage on VBUS with respect to Vss in Absolute Maximum Ratings.
Added the characteristic, DC5a to Operating MIPS vs. Voltage (see
Table 29-1).
Updated or added the following parameters to the Operating Current
(IDD) DC Characteristics: DC20, DC23, DC24c, DC25d, DC26c (see
Table 29-5).
Added the following parameters to the Idle Current (IIDLE) DC
Characteristics: DC30c, DC31c, DC32c, DS33c, DC34c, DC35c, and
DC36c (see Table 29-6).
Added the following parameters to the Power-down Current (IPD) DC
Characteristics: DC40g, DC40h, DC40i, DC41g, DC41h, DC42g, DC42h,
DC42i, DC43h, and DC43i (see Table 29-7).
Added the Brown-out Reset (BOR) Electrical Characteristics (see
Table 29-10).
Removed all Conditions from the Program Memory DC Characteristics
(see Table 29-11).
Removed the AC Characteristics voltage reference table (Table 29-15).
Added Note 2 to the PLL Clock Timing Specifications (see Table 29-18).
Updated the OC/PWM Module Timing Characteristics (see Figure 29-9).
Added parameter IM51 and Note 3 to the I2Cx Bus Data Timing
Requirements (Master Mode) (see Table 29-32).
Added parameter numbers (AD13, AD14, and AD15) to the ADC Module
Specifications (see Table 29-34).
Updated the 10-bit ADC Conversion Rate Parameters (see Table 29-35).
Updated parameter AD57 (TSAMP) in the Analog-to-Digital Conversion
Timing Requirements (see Table 29-36).
Section 30.0 “Packaging Information”
Product Identification System
Updated the Conditions for parameters USB313, USB318, and USB319
in the OTG Electrical Specifications (see Table 29-40).
Updated the 64-Lead Plastic Quad Flat, No Lead Package (MR) –
9x9x0.9 mm Body [QFN] packing diagram.
Added the new V-Temp (V) temperature information.
DS61143H-page 208
© 2011 Microchip Technology Inc.