PIC32MX320F032H_11 Datasheet, PDF (159/214 Pages) Microchip Technology – High-Performance, General Purpose and USB, 32-bit Flash Microcontrollers

PIC32MX3XX/4XX
TABLE 29-11: DC CHARACTERISTICS: PROGRAM MEMORY⁽³⁾
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤TA ≤+85°C for Industrial
-40°C ≤TA ≤+105°C for V-Temp
Param.
No.
Symbol
Characteristics
Min. Typical⁽¹⁾ Max. Units
Conditions
Program Flash Memory
D130 EP
Cell Endurance
1000
—
— E/W
—
D131 VPR
VDD for Read
VMIN
—
3.6 V
—
D132 VPEW
VDD for Erase or Write 3.0
—
3.6 V
—
D134 TRETD
Characteristic Retention 20
—
— Year
—
D135 IDDP
Supply Current during
—
10
— mA
—
Programming
TWW
Word Write Cycle Time 20
—
40 μs
—
D136 TRW
Row Write Cycle Time⁽²⁾ 3
4.5
— ms
—
(128 words per row)
D137 TPE
Page Erase Cycle Time 20
—
— ms
—
TCE
Chip Erase Cycle Time 80
—
— ms
—
D138 LVDstartup Flash LVD Delay
—
—
6 μs
—
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
2: The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities
during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus
loads are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The
default Arbitration mode is mode 1 (CPU has lowest priority).
3: Refer to the “PIC32MX Flash Programming Specification” (DS61145) for operating conditions during
programming and erase cycles.
TABLE 29-12: PROGRAM FLASH MEMORY WAIT STATE CHARACTERISTICS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤TA ≤+85°C for Industrial
-40°C ≤TA ≤+105°C for V-Temp
Required Flash wait states
SYSCLK
Units
Comments
0 Wait State
1 Wait State
0 to 30
31 to 60
MHz
—
2 Wait States
61 to 80
Note 1: 40 MHz maximum for PIC32MX320F032H and PIC32MX420F032H devices.
© 2011 Microchip Technology Inc.
DS61143H-page 159