PIC32MX320F032H_11 Datasheet, PDF (206/214 Pages) Microchip Technology – High-Performance, General Purpose and USB, 32-bit Flash Microcontrollers

PIC32MX3XX/4XX
TABLE A-2: MAJOR SECTION UPDATES (CONTINUED)
Section Name
Update Description
Section 29.0 “Electrical
Characteristics”
Updated the Absolute Maximum Ratings and added Note 3.
Added Thermal Packaging Characteristics for the 121-pin XBGA package
(see Table 29-3).
Updated the conditions for parameters DC20, DC21, DC22 and DC23 in
Table 29-5.
Updated the comments for parameter D321 (CEFC) in Table 29-15.
Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics,
changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see
Figure 29-13).
Section 30.0 “Packaging Information” Added the 121-pin XBGA package marking information and package
details.
“Product Identification System”
Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).
Added the definition for Speed.
DS61143H-page 206
© 2011 Microchip Technology Inc.