PIC24F16KL402 Datasheet, PDF (200/260 Pages) Microchip Technology – Low-Power, Low-Cost, General Purpose 16-Bit Flash Microcontrollers with nanoWatt XLP Technology

PIC24F16KL402 FAMILY
26.1 DC Characteristics
FIGURE 26-1:
PIC24F16KL402 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
3.60V
3.00V
1.80V
3.60V
3.00V
8 MHz
Frequency
32 MHz
Note: For frequencies between 8 MHz and 32 MHz, FMAX = 20 MHz * (VDD – 1.8) + 8 MHz.
TABLE 26-1: THERMAL OPERATING CONDITIONS
Rating
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
TJ
-40
TA
-40
Typ Max Unit
—
+125
°C
—
+85
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
TABLE 26-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 20-Pin SPDIP
JA
62.4
—
°C/W
1
Package Thermal Resistance, 28-Pin SPDIP
JA
60
—
°C/W
1
Package Thermal Resistance, 20-Pin SSOP
JA
108
—
°C/W
1
Package Thermal Resistance, 28-Pin SSOP
JA
71
—
°C/W
1
Package Thermal Resistance, 20-Pin SOIC
JA
75
—
°C/W
1
Package Thermal Resistance, 28-Pin SOIC
JA
80.2
—
°C/W
1
Package Thermal Resistance, 20-Pin QFN
JA
43
—
°C/W
1
Package Thermal Resistance, 28-Pin QFN
JA
32
—
°C/W
1
Package Thermal Resistance, 14-Pin SPDIP
JA
62.4
—
°C/W
1
Package Thermal Resistance, 14-Pin TSSOP
JA
108
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS31037B-page 200
 2011 Microchip Technology Inc.