IS66WVC2M16ALL Datasheet, PDF (1/67 Pages) Integrated Silicon Solution, Inc – Mixed Mode supports asynchronous write and synchronous read operation

IS66WVC2M16ALL
32Mb Async/Page/Burst CellularRAM 1.5
Overview
The IS66WVC2M16ALL is an integrated memory device containing 32Mbit Pseudo Static Random Access
Memory using a self-refresh DRAM array organized as 2M words by 16 bits. The device includes several
power saving modes : Reduced Array Refresh mode where data is retained in a portion of the array and
Temperature Controlled Refresh. Both these modes reduce standby current drain. The device can be
operated in a standard asynchronous mode and high performance burst mode. The die has separate power
rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core.
Features
 Single device supports asynchronous , page,
and burst operation
 Mixed Mode supports asynchronous write and
synchronous read operation
 Dual voltage rails for optional performance
 VDD 1.7V~1.95V, VDDQ 1.7V~1.95V
 Asynchronous mode read access : 70ns
Interpage Read access : 70ns
Intrapage Read access : 20ns
 Burst mode for Read and Write operation
 4, 8, 16,32 or Continuous
 Low Power Consumption
 Asynchronous Operation < 25 mA
 Intrapage Read < 18mA
 Burst operation < 35 mA (@104Mhz)
 Standby < 150 uA(max.)
 Deep power-down (DPD) < 3uA (Typ)
 Low Power Feature
 Reduced Array Refresh
 Temperature Controlled Refresh
 Deep power-down (DPD) mode
 Operation Frequency up to 104Mhz
 Operating temperature Range
Industrial -40°C~85°C
 Package: 54-ball VFBGA
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Rev.A | June 2011
www.issi.com – [e-mail]
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