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HYS64D16301GU Datasheet, PDF (26/51 Pages) Infineon Technologies AG – 184-Pin Unbuffered Dual-In-Line Memory Modules
HYS[64/72]D[16x01/32x00/64x20][G/E]U-[5/6/7/8]-B
Unbuffered DDR SDRAM Modules
Electrical Characteristics
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
10) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ns,
measured between VOH(ac) and VOL(ac).
11) CAS Latency 1.5 operation is supported on DDR200 devices only
12) tRPRES is defined for CL = 1.5 operation only
13) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock
cycle time.
14) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
Table 16 AC Timing - Absolute Specifications –6/–5
Parameter
Symbol
–6
DDR333
–5
Unit Note/
DDR400B
Test Condition 1)
DQ output access time from CK/CK
DQS output access time from CK/CK
CK high-level width
CK low-level width
Clock Half Period
Clock cycle time
tAC
tDQSCK
tCH
tCL
tHP
tCK
DQ and DM input hold time
tDH
DQ and DM input setup time
tDS
Control and Addr. input pulse width (each tIPW
input)
DQ and DM input pulse width (each input) tDIPW
Data-out high-impedance time from CK/CK tHZ
Data-out low-impedance time from CK/CK tLZ
Write command to 1st DQS latching
transition
tDQSS
DQS-DQ skew (DQS and associated DQ tDQSQ
signals)
Data hold skew factor
tQHS
DQ/DQS output hold time
DQS input low (high) pulse width (write
cycle)
tQH
tDQSL,H
Min. Max. Min. Max.
–0.7 +0.7 –0.6 +0.6 ns
–0.6 +0.6 –0.5 +0.5 ns
0.45 0.55 0.45 0.55 tCK
0.45 0.55 0.45 0.55 tCK
min. (tCL, tCH) min. (tCL, tCH) ns
6
12 5
12 ns
6
12 6
12 ns
7.5 12 7.5 12 ns
0.45 —
0.4 —
ns
0.45 —
0.4 —
ns
2.2 —
tbd —
ns
1.75 —
tbd —
ns
–0.7 +0.7 –0.6 +0.6 ns
–0.7 +0.7 –0.6 +0.6 ns
0.75 1.25 0.75 1.25 tCK
—
—
—
—
tHP –
tQHS
0.35
+0.40
+0.45
+0.50
+0.55
—
—
—
—
—
—
tHP –
tQHS
0.35
+0.40 ns
+0.40 ns
+0.50 ns
+0.50 ns
—
ns
—
tCK
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
CL = 3.0 2)3)4)5)
CL = 2.5 2)3)4)5)
CL = 2.0 2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)6)
2)3)4)5)6)
2)3)4)5)7)
2)3)4)5)7)
2)3)4)5)
TFBGA 2)3)4)5)
TSOPII 2)3)4)5)
TFBGA 2)3)4)5)
TSOPII 2)3)4)5)
2)3)4)5)
2)3)4)5)
Data Sheet
26
V1.1, 2003-07