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GS4288C09 Datasheet, PDF (57/62 Pages) GSI Technology – 32M x 9, 16M x 18, 8M x 36 288Mb CIO Low Latency DRAM (LLDRAM) II
GS4288C09/18/36L
TAP DC Electrical Characteristics and Operating Conditions
Description
Condition
Symbol
Min
Max
Units
Notes
Input High (logic 1) Voltage
—
VIH
VREF + 0.15
VDD + 0.3
V
1, 2
Input High (logic 0) Voltage
—
VIL
VSS – 0.3
VREF – 0.15
V
1, 2
Input Leakage Current
Output disabled,
0 VVIN VDDQ
ILI
–5.0
5.0

—
Output Leakage Current
0 VVIN VDD
ILO
–5.0
5.0

—
Output Low Voltage
IOLC = 100 
VOL1
—
0.2
V
1
Output Low Voltage
IOLT = 2mA
VOL2
—
0.4
V
1
Output High Voltage
IOHC = 100 
VOH1
VDDQ – 0.2
—
V
1
Output High Voltage
IOHT= 2mA
VOH2
VDDQ – 0.4
—
V
1
Notes:
1. All voltages referenced to VSS (GND).
2. Overshoot = VIH(AC) VDD + 0.7 V for t tTHTH/2; undershoot = VIL(AC)– 0.5 V for t tTHTH/2; during normal operation, VDDQ must
not exceed VDD.
Scan Register Sizes
Register Name
Instruction
Bypass
ID
Boundary Scan
Bit Size
8
1
32
113
JTAG TAP Instruction Codes
Instruction
Code
EXTEST
0000 0000
IDCODE
0010 0001
SAMPLE/PRELOAD 0000 0101
CLAMP
0000 0111
HIGH-Z
0000 0011
BYPASS
1111 1111
Description
Captures I/O ring contents; Places the Boundary Scan Register between TDI and TDO. Data
driven by output balls are determined from values held in the Boundary Scan Register.
Loads the ID register with the vendor ID code and places the register between TDI and TDO. This
operation does not affect LLDRAM II operations.
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. This
operation does not affect LLDRAM II operations.
Selects the bypass register to be connected between TDI and TDO. Data driven by output balls are
determined from values held in the Boundary Scan Register.
Selects the bypass register to be connected between TDI and TDO. All outputs are forced into
High-Z.
Places Bypass Register between TDI and TDO.This operation does not affect LLDRAM II
operations.
Rev: 1.03 7/2014
57/62
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology