MC9S08QG8_09 Datasheet, PDF (291/314 Pages) Freescale Semiconductor, Inc – HCS08 Microcontrollers

Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08QG8 and MC9S08QG4 devices.
Table B-1. Device Numbering System
Device Number¹
Memory
FLASH
RAM
24-Pin
Available Packages²
16-Pin
8-Pin
MC9S08QG8
8K
512
24 QFN
MC9S08QG4
4K
256
24 QFN
1 _{See Table 1-1 for a complete description of modules included on each device.}
2 _{See Table B-2 for package information.}
16 PDIP
16 QFN
16 TSSOP
16 QFN
16 TSSOP
8 DFN
8 NB SOIC
8 DFN
8 PDIP
8 NB SOIC
B.1.1 Device Numbering Scheme
MC 9 S08 QG 8 (4) X XX
Status
(MC = Fully Qualified)
Memory
(9 = FLASH-based)
Core
Family
1 _{Only maskset 4M77B has this additional number.}
E
RoHS compliance indicator (E = yes)
Package designator (see Table B-2)
Temperature range (C = –40°C to +85°C)
4M77B¹.
(M = –40°C to +125°C)
Memory Size (in Kbytes)
B.2 Mechanical Drawings
The following pages are mechanical specifications for MC9S08QG8/4 package options. See Table B-2 for
the document number for each package type.
Table B-2. Package Information
Pin Count
24
16
16
16
Type
QFN
PDIP
QFN
TSSOP
Designator
FK
PB
FF
DT
Document No.
98ARL10605D
98ASB42431B
98ARE10614D
98ASH70247A
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Freescale Semiconductor
289