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M13S64322A Datasheet, PDF (7/49 Pages) Elite Semiconductor Memory Technology Inc. – 512K x 32 Bit x 4 Banks Double Data Rate Synchronous DRAM
ESMT
AC Operating Test Conditions
Parameter
Input reference voltage for clock (VREF)
Input signal maximum peak swing
Input signal minimum slew rate
Input levels (VIH/VIL)
Input timing measurement reference level
Output timing reference level
Preliminary
M13S64322A
Value
0.5*VDDQ
1.5
1.0
VREF+0.35/VREF-0.35
VREF
VTT
Unit
V
V
V/ns
V
V
V
AC Timing Parameter & Specifications
(VDD = 2.5V±5%, VDDQ=2.5V±5%, TA =0 °C to 70 °C )(Note)
Parameter
Clock Period (CL3)
(CL4)
Symbol
tCK
-4
MIN
MAX
4
10
-
-
-5
MIN
MAX
5
10
ns
-
-
ns
Access time from CLK/ CLK
tAC
-0.5
0.5
-0.75
0.75
ns
CLK high-level width
tCH
0.45
0.55
0.45
0.55
tCK
CLK low-level width
tCL
0.45
0.55
0.45
0.55
tCK
Data strobe edge to clock edge
tDQSCK
-0.5
0.5
-0.75
0.75
ns
Clock to first rising edge of DQS delay
tDQSS
0.75
1.25
0.75
1.25
tCK
Data-in setup time (to DQS)
tDS
0.4
0.4
ns
Data-in hold time (to DQS)
tDH
0.4
0.4
ns
DM setup time (to DQS)
tDQMS
0.4
0.4
ns
DM hold time (to DQS)
tDQMH
0.4
0.4
ns
Input setup time
tIS
0.75
1.1
ns
Input hold time
tIH
0.75
1.1
ns
DQS input high pulse width
tDQSH
0.4
0.6
0.4
0.6
tCK
DQS input low pulse width
tDQSL
0.4
0.6
0.4
0.6
tCK
Clock to DQS write preamble setup time
tWPRES
0
0.5
0
0.5
tCK
Clock to DQS write preamble hold time
tWPREH
0.25
1.25
0.25
1.25
tCK
Write postamble
tWPST
0.25
0.25
tCK
Data strobe edge to output data edge
Half Clock Period
DQ-DQS output hold time
tDQSQ
-0.35
0.35
-0.5
0.5
ns
tHP
tCLmin or
tCHmin
tCLmin or
tCHmin
ns
tQH
tHP-0.35
tHP-0.5
ns
Data-out high-impedance windows from
CLK/ CLK
tHZ
-0.5
0.5
-0.75
0.75
ns
Data-out low-impedance windows from
CLK/ CLK
tLZ
-0.5
0.5
-0.75
0.75
ns
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
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