M14D1G1664A-2S Datasheet, PDF (15/65 Pages) Elite Semiconductor Memory Technology Inc. – Internal pipelined double-data-rate architecture; two data access per clock cycle

ESMT
(Preliminary)
AC Timing Parameter & Specifications - Contiuned
Parameter
Symbol
DQ hold skew factor
Active to Precharge command
Active to Active command
(same bank)
Auto Refresh row cycle time
Active to Read, Write delay
Precharge command period
Active bank A to Active bank B
command
Four Activate Window
Write recovery time
Write data in to Read command
delay
Col. address to Col. address
delay
Average periodic Refresh
interval ( -40℃ ≦T_C ≦ +85℃)
Average periodic Refresh
interval (+85℃ ＜T_C ≦ +95℃)
Write preamble
Write postamble
DQS Read preamble
DQS Read postamble
Load Mode Register / Extended
Mode Register cycle time
Auto Precharge write recovery
+ Precharge time
Internal Read to Precharge
command delay
Exit Self Refresh to Read
command
Exit Self Refresh to non-Read
command
Exit Precharge Power-Down to
any non-Read command
Exit Active Power-Down to
Read command
Exit active power-down to Read
command
(slow exit / low power mode)
CKE minimum pulse width
(high and low pulse width)
t_QHS
t_RAS
t_RC
t_RFC
t_RCD
t_RP
t_RRD
t_FAW
t_WR
t_WTR
t_CCD
t_REFI
t_REFI
t_WPRE
t_WPST
t_RPRE
t_RPST
t_MRD
t_DAL
t_RTP
t_XSRD
t_XSNR
t_XP
t_XARD
t_XARDS
t_CKE
-2.5
Min.
45
57.5
127.5
12.5
12.5
10
45
15
7.5
Max.
300
70K
2
7.8
3.9
0.35
0.4
0.6
0.9
1.1
0.4
0.6
2
WR+tn_RP
7.5
200
t_RFC + 10
2
2
8 - AL
3
Elite Semiconductor Memory Technology Inc.
M14D1G1664A (2S)
Automotive Grade
Unit Note
ps
ns
ns
ns
ns
ns
ns
ns
ns
ns
19
t_CK
us
us
t_CK (avg)
t_CK (avg)
t_CK (avg) 11
t_CK (avg) 12
t_CK
t_CK
1
ns
t_CK
ns
t_CK
t_CK
3
t_CK
2,3
t_CK
Publication Date : Jul. 2014
Revision : 0.1
15/65