XC2VP2 Datasheet, PDF (1/430 Pages) Xilinx, Inc – Summary of Features

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R Virtex-II Pro and Virtex-II Pro X Platform FPGAs:
Complete Data Sheet
DS083 (v4.7) November 5, 2007 ⁰
Product Specification
Module 1:
Introduction and Overview
10 pages
• Summary of Features
• General Description
• Architecture
• IP Core and Reference Support
• Device/Package Combinations and Maximum I/O
• Ordering Information
Module 2:
Functional Description
60 pages
• Functional Description: RocketIO™ X Multi-Gigabit
Transceiver
• Functional Description: RocketIO Multi-Gigabit
Transceiver
• Functional Description: Processor Block
• Functional Description: PowerPC™ 405 Core
• Functional Description: FPGA
- Input/Output Blocks (IOBs)
- Digitally Controlled Impedance (DCI)
- On-Chip Differential Termination
- Configurable Logic Blocks (CLBs)
- 3-State Buffers
- CLB/Slice Configurations
- 18-Kb Block SelectRAM™ Resources
- 18-Bit x 18-Bit Multipliers
- Global Clock Multiplexer Buffers
- Digital Clock Manager (DCM)
• Routing
• Configuration
Module 3:
DC and Switching Characteristics
57 pages
• Electrical Characteristics
• Performance Characteristics
• Switching Characteristics
• Pin-to-Pin Output Parameter Guidelines
• Pin-to-Pin Input Parameter Guidelines
• DCM Timing Parameters
• Source-Synchronous Switching Characteristics
Module 4:
Pinout Information
302 pages
• Pin Definitions
• Pinout Tables
- FG256/FGG256 Wire-Bond Fine-Pitch BGA Package
- FG456/FGG456 Wire-Bond Fine-Pitch BGA Package
- FG676/FGG676 Wire-Bond Fine-Pitch BGA Package
- FF672 Flip-Chip Fine-Pitch BGA Package
- FF896 Flip-Chip Fine-Pitch BGA Package
- FF1148 Flip-Chip Fine-Pitch BGA Package
- FF1152 Flip-Chip Fine-Pitch BGA Package
- FF1517 Flip-Chip Fine-Pitch BGA Package
- FF1696 Flip-Chip Fine-Pitch BGA Package
- FF1704 Flip-Chip Fine-Pitch BGA Package
IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
© 2002–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is
a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners.
DS083 (v4.7) November 5, 2007
www.xilinx.com
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Product Specification