W972GG6JB-18-TR Datasheet, PDF (86/87 Pages) Winbond – 16M 8 BANKS 16 BIT DDR2 SDRAM

W972GG6JB
12. PACKAGE SPECIFICATION
Package Outline WBGA84 (11x13 mm², ball pitch: 0.8mm, Ø =0.45mm)
Pin A1 index
E
A // bbb C
aaa
A1
E1
987
Pin A1 index
3 21
A
B
C
D
E
F
A
G
H
J
K
L
M
N
P
R
B
ccc C
eE
The window-side
C
84xΦb
encapsulant
Seating plane
Solder ball diameter refers.
To Post reflow condition.
ddd M C A B
eee M C
Dimension (mm)
Symbol
Min. Nom. Max.
A
---
--- 1.20
A1 0.25 --- 0.40
b
0.40 0.45 0.50
D 12.90 13.00 13.10
E 10.90 11.00 11.10
D1
11.20 BSC.
E1
6.40 BSC.
eE
0.80 BSC.
eD
0.80 BSC.
aaa
---
--- 0.15
bbb ---
--- 0.20
ccc
---
--- 0.10
ddd
---
--- 0.15
eee
---
--- 0.08
Ball Land
Ball Opening
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
- 86 -
Publication Release Date: Jul. 28, 2014
Revision: A03