DS90UR903Q-Q1 Datasheet, PDF (32/44 Pages) Texas Instruments – 10 - 43MHz 18 Bit Color FPD-Link II Serializer and Deserializer

DS90UR903Q-Q1, DS90UR904Q-Q1
SNLS346C – AUGUST 2011 – REVISED JUNE 2014
10 Layout
www.ti.com
10.1 Layout Guidelines
Circuit board layout and stack-up for the Ser/Des devices should be designed to provide low-noise power feed to
the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize
unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by
using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance
for the PCB power system with low-inductance parasitics, which has proven especially effective at high
frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the
range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the
tantalum capacitors should be at least 5X the power supply voltage being used.
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external
bypass capacitor will increase the inductance of the path.
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing
the impedance at high frequency.
Some devices provide separate power for different portions of the circuit. This is done to isolate switching noise
effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin
Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In
some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs.
Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the
differential lines to prevent coupling from the LVCMOS lines to the differential lines. Closely-coupled differential
lines of 100 Ohms are typically recommended for differential interconnect. The closely coupled lines help to
ensure that coupled noise will appear as common-mode and thus is rejected by the receivers. The tightly coupled
lines will also radiate less.
Information on the LLP style package is provided in the AN-1187 Leadless Leadframe Package (LLP) Application
Report (literature number SNOA401).
10.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the LLP package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown below:
32
Submit Documentation Feedback
Copyright © 2011–2014, Texas Instruments Incorporated
Product Folder Links: DS90UR903Q-Q1 DS90UR904Q-Q1