GC4016 Datasheet, PDF (32/83 Pages) Texas Instruments – MULTI-STANDARD QUAD DDC CHIP

GC4016 MULTI-STANDARD QUAD DDC CHIP
DATA SHEET REV 1.0
4.0 PACKAGING
4.1 GC4016-PB 160 Ball Plastic Ball Grid Array (PBGA)
The GC4016 chip is packaged in a 160 lead plastic ball grid array package.
0.36 mm
A2
D1
13 mm
1.56 mm
A1 _A
0.4 mm
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A
B
C
D
E
GRAYCHIP
F
GC4016-PB
G
H
QUAD DDC
D
J
MMMMMM
K
LLL YYWW
L
M
N
P
TOP VIEW
160 BALL PLASTIC BALL GRID ARRAY
DIMENSION
D (width body)
D1 (width cover)
P (ball pitch)
B (ball width)
L (overhang)
A (overall height)
A1 (ball height)
A2 (substrate thickness)
TYP
15 mm
13 mm
1.0 mm
0.5 mm
1.0 mm
1.56 mm
0.4 mm
0.36 mm
TOLERANCE
+-0,05 mm
+0.7 -0.05 mm
+-0.05 mm
+-0.1 mm
+-0.05 mm
+0.19 -0.21 mm
+-0.1 mm
+-0.05 mm
MARKING:
MMMMMM = Mask Code
LLL = Lot Code
YYWW = Date Code
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13 14
BOTTOM VIEW
L
1.0 mm
P
1.0 mm
B
0.5 mm
V_CORE:
V_PAD:
C14, D2, L5, L13, M8, P3, P10
B14, C3, D6, D8, D10, G12, M3, P5, P12
GND:
GND (THERMAL):
UNUSED:
JTAG:
A3, A12, L7, L9, M1, M5, N11
A8, A13, C1, D11, E4, G11, M14, N3, P4
G7, G8, H7, H8
A2, B1, B2, B3, B13, C2, M2, M12, M13,
N1, N2, N12, N13, N14, P2, P13
B12 (TCK), C10 (TMS), C12 (TDO), C13 (TDI)
NOTE: 0.01 to 0.1 µf DECOUPLING CAPACITORS SHOULD BE PLACED
AS CLOSE AS POSSIBLE TO THE MIDDLE OF EACH SIDE OF THE CHIP
Figure 17. GC4016 160 Pin Plastic Ball Grid Array
© GRAYCHIP,INC.
- 27 -
August 27, 2001
This document contains information which may be changed at any time without notice