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M36W0R6030T0 Datasheet, PDF (8/26 Pages) STMicroelectronics – 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030T0, M36W0R6030B0
FUNCTIONAL DESCRIPTION
The Flash memory and SRAM components have
separate power supplies but share the same
grounds. They are distinguished by three Chip En-
able inputs: EF for the Flash memory and E1S and
E2S for the SRAM.
Recommended operating conditions do not allow
more than one device to be active at a time. The
most common example is simultaneous read oper-
ations on one of the Flash and the SRAM which
would result in a data bus contention. Therefore it
is recommended to put the other devices in the
high impedance state when reading the selected
device.
Figure 4. Functional Block Diagram
VDDF VPPF VDDQ
A19-A21
A0-A18
EF
GF
WF
LF
KF
RPF
WPF
64 Mbit
Flash
Memory
WAITF
DQ0-DQ15
VDDS
8/26
E1S
GS
WS
E2S
UBS
LBS
8 Mbit SRAM
VSS
AI08536C