MB84VD2118XEM-70 Datasheet, PDF (51/52 Pages) SPANSION – Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS

MB84VD2118XEM/2119XEM-70
s PACKAGE DIMENSION
56-ball plastic FBGA
(BGA-56P-M02)
7.20±0.10(.283±.004)
0.20(.008) S B
7.00±0.10
(.276±.004)
1.09
+0.11
–0.10
.043
+.004
–.004
(Mounting height)
0.39±0.10
(.015±.004)
(Stand
off)
0.80(.031)
REF
A
B
0.40(.016)
REF
0.40(.016)
REF
0.80(.031)
REF
8
7
6
5
4
3
2
1
INDEX-MARK AREA
S
0.20(.008) S A
HGF EDCBA
56-ø0.45
+0.10
–0.05
56-ø.018
+.004
–.002
INDEX
0.08(.003) M S A B
0.10(.004) S
C _{2002 FUJITSU LIMITED B56002S-c-1-1}
Dimensions in mm (inches)
Note : The values in parentheses are regerence values.
51