COM20022I-3.3V Datasheet, PDF (68/73 Pages) SMSC Corporation – 10 Mbps ARCNET (ANSI 878.1) Controller with 2Kx8 On-Chip RAM

10 Mbps ARCNET (ANSI 878.1) Controller with 2Kx8 On-Chip RAM
Datasheet
Figure 8.17 - 48 Pin TQFP Package Outline
Table 8.1 - 48 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
A
~
~
1.6
A1
0.05
0.10
0.15
A2
1.35
1.40
1.45
D
8.80
9.00
9.20
D/2
4.40
4.50
4.60
D1
6.90
7.00
7.10
E
8.80
9.00
9.10
E/2
4.40
4.50
4.60
E1
6.90
7.00
7.10
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.50 Basic
θ
0^o
~
7^o
W
0.17
~
0.27
R1
0.08
~
~
R2
0.08
~
0.20
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1_{/2 X Span Measure from Centerline}
X body Size
Y Span
1_{/2 Y Span Measure from Centerline}
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
ccc
~
~
0.08
Coplanarity (Test House)
Notes:
1) Controlling Unit: millimeter
2) Tolerance on the position of the leads is ± 0.04 mm maximum.
3) Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
4) Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
5) Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 03-08-07
Page 68
DATASHEET
SMSC COM20022I 3.3V Rev.C