91C100FDREVB Datasheet, PDF (67/68 Pages) SMSC Corporation – FEAST FAST ETHERNET CONTROLLER WITH FULL DUPLEX CAPABILITY

DIM
MIN NOM
MAX
REMARK
A
1.60
Overall Package Height
A1
0.05
0.15
Standoff
A2
1.35
1.45
Body Thickness
D
29.80 30.00
30.20
X Span
D/2 14.90 15.00
15.10
1/2 X Span Measure From Centerline
D1
27.90 28.00
28.10
X Body Size
E
29.80 30.00
30.20
Y Span
E/2 14.90 15.00
15.10
1/2 Y Span Measure From Centerline
E1
27.90 28.00
28.10
Y Body Size
H
0.09
0.23
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length From Centerline
L1
1.00
Lead Length
e
0.50 BSC
Lead Pitch
0
0
7
Lead Foot Angle
W
0.17
0.27
Lead Width
R1
0.08
Lead Shoulder Radius
R2
0.08
0.20
Lead Foot Radius
ccc
0.0762 ^{Coplanarity (Assemblers)}
ccc
0.08
Coplanarity (Test House)
Notes:
1 Controlling Unit: Millimeter.
2 Tolerance on the position of the leads is 0.04mm maximum.
3 Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25mm.
4 _{Dimension for foot length L measured at the gauge plane 0.25mm above the seating plane, is 0.78-1.08mm.}
5 Details of pin 1 identifier are optional but must be located within the zone indicated.
FIGURE 28 - 208 PIN TQFP PACKAGE OUTLINES
SMSC DS – LAN91C100FD REV. B
Page 67
Rev. 05/31/2000