SI5100 Datasheet, PDF (37/40 Pages) Silicon Laboratories – SiPHY™ OC-48/STM-16 SONET/SDH TRANSCEIVER

20. 15x15 mm 195L CBGA Recommended PCB Layout
Placement Courtyard
Si5100
Symbol
Parameter
Dimension
Notes
Min
Nom
Max
C
Column Width
—
13.00 REF
—
D
Row Height
—
13.00 REF
—
E
Pad Pitch
—
1.00 BSC
—
F
Placement Courtyard
16.00
—
—
1
X
Pad Diameter
0.64
0.68
0.72
2, 3
Notes:
1. The Placement Courtyard is the minimum keep-out area required to assure assembly clearances.
2. Pad Diameter is Copper Defined (Non-Solder Mask Defined/NSMD).
3. OSP Surface Finish Recommended
4. Controlling dimension is millimeters.
5. Land Pad Dimensions comply with IPC-SM-782 guidelines.
6. Target solder paste volume per pad is 0.065 mm3 ± 0.010 mm3 (4000 mils3 ± 600 mils3).
Recommended stencil aperture dimensions to achieve target solder paste volume are 0.191mm
thick x 0.68±0.01 mm diameter, with a 0.025 mm taper.
7. Recommended stencil type is chemically etched stainless steel with circularly tapered apertures.
Rev. 1.1
37