GV7704 Datasheet, PDF (49/52 Pages) Semtech Corporation – Quad HD-VLC Receiver

7. Packaging Information
7.1 Package Dimensions
TOP VIEW
PIN A1 CORNER
B
1 2 3 4 5 6 7 8 9 10 11 12 13
A
B
C
D
E
F
G
D
H
J
K
L
M
N
E
A
aaa (4X)
Package:
Body Size:
Ball Pitch:
Total Thickness:
Mold Thickness:
Substrate Thickness:
Ball Diameter:
Stand Off:
Ball Width:
Package Edge Tolerance:
Mold Flatness:
Coplanarity:
Ball Offset (Package):
Ball Offset (Ball):
Ball Count:
Edge Ball Center to Center:
Symbol Common Dimensions
LBGA
X
E
Y
D
X
eE
Y
eD
11.000
11.000
0.800
0.800
A
1.470 ± 0.100
M
0.700 Ref.
S
0.560 Ref.
0.300
A1
0.160 ~ 0.260
b
0.270 ~ 0.370
aaa
0.050
bbb
0.100
ddd
0.080
eee
0.150
fff
0.050
n
X
E1
Y
D1
169
9.600
9.600
BOTTOM VIEW
Øeee M C
Øddd M C A B
Øb (n X)
A1 CORNER
13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
D1
G
H
J
K
L
M
N
eE
E1
SIDE VIEW
C
5. ^{SEATING PLANE}
bbb C
ddd C
3.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M – 1994.
2. SOLDER BALL POSITION DESIGNATION PER JESD 95–1, SPP–010.
3. THIS DIMENSION INCLUDES STAND-OFF HEIGHT, PACKAGE BODY THICKNESS
AND LID HEIGHT, BUT DOES NOT INCLUDE ATTACHED FEATURES, E.G., EXTERNAL
HEATSINK OR CHIP CAPACITORS. AN INTEGRAL HEATSLUG IS NOT CONSIDERED AN
ATTACHED FEATURE.
4. DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO PRIMARY DATUM C.
5. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
6. ALL DIMENSIONS ARE IN MILLIMETERS.
Figure 7-1: GV7704 Package Dimensions
GV7704
Preliminary Data Sheet Rev.3
PDS-060376
September 2015
www.semtech.com
49 of 52
Semtech