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HYB18T256161BF Datasheet, PDF (3/40 Pages) Qimonda AG – 256-Mbit x16 DDR2 SDRAM | |||
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Internet Data Sheet
1
Overview
HYB18T256161BFâ20/25/28
256-Mbit Double-Data-Rate-Two SDRAM
This chapter gives an overview of the 256-Mbit Double-Data-Rate-Two SDRAM product family for graphics applications and
describes its main characteristics.
1.1
Features
The 256-Mbit Double-Data-Rate-Two SDRAM offers the following key features:
⢠1.8 V ± 0.1V VDD for [â20/â25/â28]
⢠1.8 V ± 0.1V VDDQ for [â20/â25/â28]
⢠DRAM organizations with 16 data in/outputs
⢠Double Data Rate architecture:
â two data transfers per clock cycle
â four internal banks for concurrent operation
⢠Programmable CAS Latency: 3, 4, 5, 6, 7
⢠Programmable Burst Length: 4 and 8
⢠Differential clock inputs (CK and CK)
⢠Bi-directional, differential data strobes (DQS and DQS) are
transmitted / received with data. Edge aligned with read
data and center-aligned with write data.
⢠DLL aligns DQ and DQS transitions with clock
⢠DQS can be disabled for single-ended data strobe
operation
⢠Commands entered on each positive clock edge, data and
data mask are referenced to both edges of DQS
⢠Data masks (DM) for write data
⢠Posted CAS by programmable additive latency for better
command and data bus efficiency
⢠Off-Chip-Driver impedance adjustment (OCD) and On-
Die-Termination (ODT) for better signal quality.
⢠Auto-Precharge operation for read and write bursts
⢠Auto-Refresh, Self-Refresh and power saving Power-
Down modes
⢠Average Refresh Period 7.8 μs at a TCASE lower than 85°C,
3.9 μs between 85°C and 95°C
⢠Full Strength and reduced Strength (60%) Data-Output
Drivers
⢠1K page size
⢠Package: P-TFBGA-84
⢠RoHS Compliant Products1)
Product Number
HYB18T256161BFâ20/25/28
TABLE 1
Ordering Information for RoHS compliant products
Org.
Clock (MHz)
Package
à 16
500/400/350
P-TFBGA-84
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.20, 2007-06
3
11232006-QP6X-6EM0
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