SAA8200HL Datasheet, PDF (68/71 Pages) NXP Semiconductors – Ensation Base integrated wireless audio baseband

Philips Semiconductors
SAA8200HL
Ensation Base integrated wireless audio baseband
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Additional soldering information
15.1 Lead-free solder
Lead-free solder can be used for soldering the TEA7000.
15.2 MSL level
MSL level: <tbd>
16. Revision history
Table 35: Revision history
Document ID
Release date Data sheet status
Change notice Doc. number Supersedes
SAA8200HL_2
Modifications:
20051017
Preliminary data sheet -
-
SAA8200HL_1
• Audio ADC supply voltages added (Table 25).
• Audio DAC R_L value revised; V_{HP_COM} value corrected; V_{ADC_COM} value added (Table 28).
• Dynamic audio characteristics revised (Table 29).
SAA8200HL_1
20041217
Objective data sheet -
9397 750 13236 -
SAA8200HL_2
Preliminary data sheet
Rev. 02 — 17 October 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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