English
Language : 

SAA8200HL Datasheet, PDF (56/71 Pages) NXP Semiconductors – Ensation Base integrated wireless audio baseband
Philips Semiconductors
SAA8200HL
Ensation Base integrated wireless audio baseband
Table 27: Control ADC characteristics …continued
Symbol Parameter
N
resolution
INL
integral non-linearity
DNL
differential non-linearity
EOS
offset error
EFS
full scale error
tconv
conversion time
Conditions
Min
Typ Max
Unit
2
-
10
bit
-
-
±1
LSB
-
-
±1
LSB
−20
-
+20
mV
−20
-
+20
mV
-
(N + 1) -
cycles
Table 28: Static audio characteristics
Symbol Parameter
Audio DAC
VREFN
VREFP
VO
negative reference voltage
positive reference voltage
output voltage
RO
output resistance
RL
load resistance
RINT
resistance between VREFP and
VREFN
Headphone amplifier
VHP_COM
VO(cm)
Voffset
RL
Isc
reference input voltage
common mode output voltage
input offset voltage
load resistance
output current at short circuit
Audio ADC
VADC_REFP positive reference voltage
VADC_REFN negative reference voltage
VADC_COM common mode reference voltage
RI
input resistance
CI
input capacitance
Low noise amplifier
RI
Voffset
input resistance
output offset voltage
Conditions
Min
digital silence
during power-down
-
-
-
[1] -
[2] 0.7
[3] >75
-
-
-
−10
16
left and right
80
center
180
-
-
-
-
-
3.5
-
Typ
Max Unit
VSSA(DAC)
-
V
VDDA(3V3_DAC)
-
V
0.5VDDA(3V3_DAC) -
V
0
-
V
1
1.3
kΩ
-
-
kΩ
4
-
kΩ
0.5VDDA(3V3_VREFP) -
V
VI(ref)
-
V
-
+10
mV
-
-
Ω
100
140
mA
200
240
mA
VDDA(3V3_ADC)
-
V
0
-
V
0.5VDDA(3V3_ADC) -
V
12
-
kΩ
24
pF
5
-
kΩ
-
1
mV
[1] Set headphone amplifier in Power-down mode before setting audio DAC in Power-down mode because the line output is connected to
the headphone driver the output of the headphone clips towards its analog supply.
[2] Exclusive the input load of the headphone driver which is 10 kΩ.
[3] The output of the DAC is already connected with the headphone driver which has an input load of 10 kΩ.
SAA8200HL_2
Preliminary data sheet
Rev. 02 — 17 October 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
56 of 71