SAA8200HL Datasheet, PDF (60/71 Pages) NXP Semiconductors – Ensation Base integrated wireless audio baseband

Philips Semiconductors
SAA8200HL
Ensation Base integrated wireless audio baseband
Table 30: DC-to-DC converter characteristics …continued
Symbol
Parameter
Conditions
Ring oscillator
I_DDA
current consumption
f_OSC
oscillator output frequency
Table 31: SRI characteristics
Symbol
Parameter
Conditions
LVDS buffer
Static
I_DDA
I_DDA(pd)
C_L
R_O
supply current
power-down supply current
load capacitor
output voltage as ratio of the digital
supply voltage
V_I(det)
Dynamic
input voltage required for detection
f_clk(max)
maximum clock frequency
Table 32: Timing characteristics
Symbol
Parameter
Conditions
Crystal oscillator
Static
C_{i(XTALH_IN)}
parasitic input capacitance pin
XTALH_IN
R_{i(XTALH_IN)}
parasitic input resistance pin
XTALH_IN
f_i = 12 MHz
P_drive
Dynamic
crystal level of driver power
f_osc
oscillator frequency
α_cl
duty cycle
t_su
start-up time
Serial interface input and output data timing; see Figure 25
f_BCK
T_cy(BCK)
bit clock frequency
bit clock cycle time
T_cy(s) is sample
frequency cycle
time
t_BCKH
t_BCKL
t_r
t_f
t_su(WS)
t_h(WS)
t_su(I2SIN)
t_h(I2SIN)
bit clock HIGH time
bit clock LOW time
rise time
fall time
word select setup time
word select hold time
data input setup time
data input hold time
SAA8200HL_2
Preliminary data sheet
Rev. 02 — 17 October 2005
Min
Typ
Max
Unit
-
-
100
µA
-
12
-
MHz
Min
Typ
Max
Unit
-
150
-
µA
-
-
1
µA
-
-
5
pF
-
0.25
-
-
100
-
mV
-
-
1
MHz
Min
Typ Max
Unit
<tbd>
<tbd>
100
-
-
-
-
-
<tbd> <tbd> pF
<tbd> <tbd> Ω
-
500
µW
12
-
50
-
500 -
MHz
%
ms
-
128f_s
Hz
-
1_{⁄128Tcy(s) s}
30
-
-
ns
30
-
-
ns
-
-
20
ns
-
-
20
ns
10
-
-
ns
10
-
-
ns
10
-
-
ns
10
-
-
ns
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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