SAA8200HL Datasheet, PDF (65/71 Pages) NXP Semiconductors – Ensation Base integrated wireless audio baseband

Philips Semiconductors
12. Package outline
SAA8200HL
Ensation Base integrated wireless audio baseband
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
y
75
76
X
51
50
ZE
c
A
100
1
pin 1 index
e
wM
b_p
D
HD
e
E ^HE
wM
b_p
26
25
ZD
vM A
B
vM B
A ^A2
A₁
detail X
(A ₃)
θ
L_p
L
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A₁ A₂ A₃ b_p
c D⁽¹⁾ E⁽¹⁾ e
H_D H_E L
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
16.25 16.25
15.75 15.75
1
L_p v
w
y Z_D ⁽¹⁾ Z_E ⁽¹⁾ θ
0.75
0.45
0.2
0.08
0.08
1.15
0.85
1.15
0.85
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT407-1
IEC
136E20
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
00-02-01
03-02-20
Fig 28. Package outline SOT407-1 (LQFP100)
SAA8200HL_2
Preliminary data sheet
Rev. 02 — 17 October 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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