TDA8029 Datasheet, PDF (46/59 Pages) NXP Semiconductors – Low power single card reader

Philips Semiconductors
TDA8029
Low power single card reader
Table 73: Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
P_tot
continuous total power dissipation
T_amb = −40 °C to +90 °C
T_stg
storage temperature
T_j
junction temperature
V_esd
electrostatic discharge
human body model
on pins I/O, V_CC, RST, CLK and GNDC
on pin PRES
on pins SAM and SBM
on other pins
[1] Human body model as defined in JEDEC Standard JESD22-A114-B, dated June 2000.
Min
-
−55
-
[1]
−6
−1.5
−1
−2
10. Thermal characteristics
Table 74: Thermal characteristics
Symbol Parameter
Conditions
Typ
R_th(j-a)
thermal resistance from junction to
in free air
80
ambient
11. Characteristics
Table 75: Characteristics
V_DD = V_DCIN = 3.3 V; T_amb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Supply
V_DD
supply voltage
2.7
-
NDS conditions
3
-
V_DCIN
input voltage for the
DC-to-DC converter
V_DD
-
I_DD(sd)
supply current in
Shut-down mode
V_DD = 3.3 V
-
-
I_DD(pd)
supply current in
V_DD = 3.3 V; card inactive;
-
-
Power-down mode microcontroller in
Power-down mode
I_DD(sl)
supply current in
V_DD = 3.3 V; card active at
-
-
Sleep mode
V_CC = 5 V; clock stopped;
microcontroller in
Power-down mode; I_CC = 0 A
Max
Unit
500
mW
+150
°C
125
°C
+6
kV
+1.5
kV
+1
kV
+2
kV
Unit
K/W
Max
Unit
6.0
V
6.0
V
6.0
V
20
µA
110
µA
800
µA
9397 750 14145
Product data sheet
Rev. 03 — 22 February 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
46 of 59