M38002M4 Datasheet, PDF (21/173 Pages) Mitsubishi Electric Semiconductor – 8-BIT SINGLE-CHIP MICROCOMPUTER

HARDWARE
GROUP EXPANSION
GROUP EXPANSION
Mitsubishi plans to expand the 3800 group as follows:
(1) Suppor t for mask ROM, One Time PR OM, EPROM,
and external ROM versions
ROM/PROM capacity ................................... 8 K to 32 K bytes
RAM capacity .............................................. 384 to 1024 bytes
(2) Packages
64P4B ............................................ Shrink plastic molded DIP
64P6N-A ............................. 0.8 mm pitch plastic molded QFP
64P6D-A ............................. 0.5 mm pitch plastic molded QFP
64S1B ......................... Shrink ceramic DIP (EPROM version)
64D0 ................ 0.8 mm pitch ceramic LCC (EPROM version)
Memory Expansion Plan
ROM size (bytes)
External ROM
Mass product
32K
M38002S
Mass product
M38004M8/E8
28K
Mass product
24K
M38003M6
20K
Mass product
16K
M38002M4/E4
12K
Mass product
8K
M38002M2/E2
Being planned
M38007M8/E8
192 256
384
512
640
768
896
1024
RAM size (bytes)
Note : Products under development or planning: the development schedule and specifications may be revised without notice.
Fig. 5 Memory expansion plan
3800 GROUP USER’S MANUAL
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