DDP3310B Datasheet, PDF (45/60 Pages) Micronas – Display and Deflection Processor

ADVANCE INFORMATION
DDP 3310B
4.6.3. Recommended Crystal Characteristics
Symbol Parameter
Pin Name Min.
Typ.
Max.
Unit
f_P
Parallel Resonance Frequency
@ C_L=16 pF
R_R
Series Resonance Resistance
@ C_L=16 pF, f_P=5 MHz
XTAL1
−
XTAL2
−
C₀
Shunt (Parallel) Capacitance
−
C_Lext
External Load Capacitances (from both
−
see
crystal pins connected to GNDD)
Remarks!
5
−
MHz
−
150
Ω
−
6
pF
27
−
pF
Remarks:
External capacitors at each crystal pin to ground are required. They are necessary to tune the effective load
capacitance (including the capacitance of the printed circuit board and the IC package) to the required load
capacitance C_L of the crystal. A higher capacitance will result in a lower clock frequency. The exact value of the
matching capacitor should be determined in the actual application (PCB layout).
C_Lext = 2 (C_L − C_PCB − C_PACK)
4.6.4. Characteristics
Min./Max. values at: T_A = 0 to 65 °C, V_SUP(P/D/O) = 4.75 to 5.25 V, R_xref = 10 kΩ, f = 27 MHz
Typical values at: T_C = 70 °C, V_SUP(P/D/O) = 5 V,
R_xref = 10 kΩ, f = 27 MHz
4.6.4.1. General Characteristics
Symbol
I_VSUPO
I_VSUPD
I_VSUPP
P_TOT
I_L
Parameter
Current Consumption
Analog Back-end
Current Consumption
Digital Processing
Current Consumption
Output Pin Driver
Total Power Dissipation
Input and Output Leakage Current
(if not otherwise specified)
Pin Name Min.
VSUPO −
VSUPD
−
VSUPP
−
−
−
Typ.
65
225
10
1.5
−
Max.
Unit
−
mA
−
mA
−
mA
−
W
0.1
µA
Micronas
45