70592C Datasheet, PDF (300/314 Pages) Microchip Technology – High-Performance, 16-bit Microcontrollers

PIC24HJXXXGPX06A/X08A/X10A
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
E1
E
b
N
α
NOTE 1 _{1 2 3}
NOTE 2 A
c
β
φ
A2
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
100
Lead Pitch
e
0.50 BSC
Overall Height
A
–
–
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
7°
Overall Width
E
16.00 BSC
Overall Length
D
16.00 BSC
Molded Package Width
E1
14.00 BSC
Molded Package Length
D1
14.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-110B
DS70592C-page 300
© 2011 Microchip Technology Inc.