PIC16F882_09 Datasheet, PDF (255/328 Pages) Microchip Technology – 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC16F882/883/884/886/887
17.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Param
No.
Sym.
Characteristic
Typ. Units
Conditions
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
2:
3:
θJA
Thermal Resistance
Junction to Ambient
47.2
C/W 40-pin PDIP package
24.4
C/W 44-pin QFN package
45.8
C/W 44-pin TQFP package
60.2
C/W 28-pin PDIP package
80.2
C/W 28-pin SOIC package
89.4
C/W 28-pin SSOP package
29
C/W 28-pin QFN package
θJC
Thermal Resistance
Junction to Case
24.7
C/W 40-pin PDIP package
20.0
C/W 44-pin QFN package
14.5
C/W 44-pin TQFP package
29
C/W 28-pin PDIP package
23.8
C/W 28-pin SOIC package
23.9
C/W 28-pin SSOP package
20.0
C/W 28-pin QFN package
TJ
Junction Temperature
150
C For derated power calculations
PD
Power Dissipation
—
W PD = PINTERNAL + PI/O
PINTERNAL Internal Power Dissipation
—
W PINTERNAL = IDD x VDD
(NOTE 1)
PI/O
I/O Power Dissipation
—
W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
PDER
Derated Power
—
W PDER = (TJ - TA)/θJA
(NOTE 2, 3)
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient Temperature.
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
© 2009 Microchip Technology Inc.
DS41291F-page 253