X6800 Datasheet, PDF (80/122 Pages) Intel Corporation – Core2 Extreme Processor

Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 27 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor and
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 27. Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)^1,2
Extended
HALT
Power (W)³
775_VR_
CONFIG_05B/
06 Guidance⁴
Minimum
T_C (°C)
Maximum
T_C (°C)
Notes
E6850
E6750
E6550
E6540
E6700
E6600
E6420
E6320
E4600
E4500
E4400
E6400
E6300
E4400
E4300
3.00
2.66
2.33
2.33
2.66
2.40
2.13
1.86
2.40
2.20
2.00
2.13
1.86
2.00
1.80
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
8.0
5
8.0
775_VR_CONFIG_
5
8.0
06
5
8.0
5
20.0/12.0
5
22.0/12.0 _{775_VR_CONFIG_}
5
12.0
06
5
12.0
5
8.0
5
8.0
775_VR_CONFIG_
06
5
8.0
5
22.0/12.0
5
22.0/12.0 _{775_VR_CONFIG_}
5
12.0
06
5
12.0
5
5
See
5
Table 28,
5
Figure 20
5
6
See
6
Table 29,
6
Figure 21
6
5
See
Table 30,
5
Figure 22
5, 7
6
See
6
Table 31,
6, 8
Figure 23
6
X6800
2.93
75.0
22.0
775_VR_CONFIG_
05B
5
See
Table 32,
6
Figure 24
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the
maximum power that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
Therefore, the maximum T_C will vary depending on the TDP of the individual processor. Refer to thermal profile
3.
figure and associated table for the allowed combinations of
Refer to the “Component Identification Information” section
power
of the
I^anⁿte^dl^®TCC^. ore™2
Extreme
Processor
X6800
and
Intel^® Core™2 Duo Desktop Processor E6000 and E4000 Sequence Specification Update for processor specific
Idle power.
4. 775_VR_CONFIG_06/775_VR_CONFIG_05B guidelines provide a design target for meeting future thermal
requirements.
5. Specification is at 35 °C T_C and typical voltage loadline.
6. Specification is at 50 °C T_C and typical voltage loadline.
7. These processors have CPUID = 06FDh.
8. These processors have CPUID = 06F2h.
80
Datasheet