X6800 Datasheet, PDF (12/122 Pages) Intel Corporation – Core2 Extreme Processor

Introduction
1.1
1.1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
The phrase “Front Side Bus” refers to the interface between the processor and system
core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to
processors, memory, and I/O.
Processor Terminology
Commonly used terms are explained here for clarification:
• Intel^® Core™2 Extreme processor X6800 — Dual core processor in the FC-
LGA6 package with a 4 MB L2 cache.
• Intel^® Core™2 Duo desktop processor E6850, E6750, E6550, E6540,
E6700, E6600, E6420, and E6320, — Dual core processor in the FC-LGA6
package with a 4 MB L2 cache.
• Intel^® Core™2 Duo desktop processor E6400, E6300, E4600, E4500,
E4400, and E4300— Dual core processor in the FC-LGA6 package with a 2 MB L2
cache.
• Processor — For this document, the term processor is the generic form of the
Intel^® Core™2 Duo desktop processor E6000 and E4000 sequence and the Intel^®
Core™2 Extreme processor X6800. The processor is a single package that contains
one or more execution units.
• Keep-out zone — The area on or near the processor that system design can not
use.
• Processor core — Processor core die with integrated L2 cache.
• LGA775 socket — The processors mate with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
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Datasheet