X6800 Datasheet, PDF (29/122 Pages) Intel Corporation – Core2 Extreme Processor

Electrical Specifications
2.7.3
Table 12.
.
Table 13.
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads)
unless otherwise stated. All specifications apply to all frequencies and cache sizes
unless otherwise stated.
GTL+ Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit Notes¹
V_IL
V_IH
V_OH
I_OL
I_LI
I_LO
Input Low Voltage
-0.10
GTLREF – 0.10
V
Input High Voltage
GTLREF + 0.10
V_TT + 0.10
V
Output High Voltage
V_TT – 0.10
V_TT
V
Output Low Current
N/A
V_{TT_MAX}/
[(R_{TT_MIN})+(2*R_{ON_MIN})]
A
Input Leakage Current
N/A
± 100
µA
Output Leakage
Current
N/A
± 100
µA
2, 3
4, 5, 3
5, 3
-
6
7
R_ON Buffer On Resistance
10
13
Ω
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. V_IL is defined as the voltage range at a receiving agent that will be interpreted as a logical low
value.
3. The V_TT referred to in these specifications is the instantaneous V_TT.
4. V_IH is defined as the voltage range at a receiving agent that will be interpreted as a logical high
value.
5. V_IH and V_OH may experience excursions above V_TT.
6. Leakage to V_SS with land held at V_TT.
7. Leakage to V_TT with land held at 300 mV.
Open Drain and TAP Output Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit Notes¹
V_OL Output Low Voltage
0
0.20
V
-
V_OH Output High Voltage
V_TT – 0.05 V_TT + 0.05 V
2
I_OL
Output Low Current
16
50
mA
3
I_LO
Output Leakage Current
N/A
± 200
µA
4
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. V_OH is determined by the value of the external pull-up resister to V_TT.
3. Measured at V_TT * 0.2.
4. For Vin between 0 and V_OH.
Datasheet
29