X6800 Datasheet, PDF (5/122 Pages) Intel Corporation – Core2 Extreme Processor

Figures
1 V_CC Static and Transient Tolerance for Processors with 4 MB L2 Cache ............................ 23
2 V_CC Static and Transient Tolerance for Processors with 2 MB L2 Cache ............................ 25
3 V_CC Overshoot Example Waveform ............................................................................. 26
4 Differential Clock Waveform ...................................................................................... 33
5 Differential Clock Crosspoint Specification ................................................................... 33
6 Differential Measurements......................................................................................... 33
7 Differential Clock Crosspoint Specification ................................................................... 34
8 Processor Package Assembly Sketch ........................................................................... 37
9 Processor Package Drawing Sheet 1 of 3 ..................................................................... 38
10 Processor Package Drawing Sheet 2 of 3 ..................................................................... 39
11 Processor Package Drawing Sheet 3 of 3 ..................................................................... 40
12 Processor Top-Side Markings Example for the Intel^® Core™2 Duo Desktop Processor
E6000 Sequence with 4 MB L2 Cache with 1333 MHz FSB .............................................. 42
13 Processor Top-Side Markings Example for the Intel^® Core™2 Duo Desktop Processors
E6000 Sequence with 4 MB L2 Cache with 1066 MHz FSB .............................................. 43
14 Processor Top-Side Markings Example for the Intel^® Core™2 Duo Desktop Processors
E6000 Sequence with 2 MB L2 Cache.......................................................................... 43
15 Processor Top-Side Markings Example for the Intel^® Core™2 Duo Desktop Processors
E4000 Sequence with 2 MB L2 Cache.......................................................................... 44
16 Processor Top-Side Markings for the Intel^® Core™2 Extreme Processor X6800 ................. 44
17 Processor Land Coordinates and Quadrants (Top View) ................................................. 45
18 land-out Diagram (Top View – Left Side) ..................................................................... 48
19 land-out Diagram (Top View – Right Side) ................................................................... 49
20 Thermal Profile (Intel^® Core™2 Duo Desktop Processor E6x50 Sequence and E6540
with 4 MB L2 Cache)................................................................................................. 81
21 Thermal Profile (Intel^® Core™ Duo Desktop Processor E6000 Sequence with
4 MB L2 Cache) ....................................................................................................... 82
22 Thermal Profile (Intel^® Core™2 Duo Desktop Processor E4500 and E4600 with
2 MB L2 Cache) ....................................................................................................... 83
23 Thermal Profile (Intel^® Core™ Duo Desktop Processor E6000 and E4000 Sequence
with 2 MB L2 Cache)................................................................................................. 84
24 Thermal Profile (Intel^® Core™2 Extreme Processor X6800)............................................ 85
25 Case Temperature (TC) Measurement Location ............................................................ 86
26 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 88
27 Processor PECI Topology ........................................................................................... 92
28 Conceptual Fan Control on PECI-Based Platforms ......................................................... 93
29 Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 93
30 Processor Low Power State Machine ........................................................................... 96
31 Mechanical Representation of the Boxed Processor ..................................................... 101
32 Space Requirements for the Boxed Processor (Side View)............................................ 102
33 Space Requirements for the Boxed Processor (Top View)............................................. 102
34 Space Requirements for the Boxed Processor (Overall View) ........................................ 103
35 Boxed Processor Fan Heatsink Power Cable Connector Description ................................ 104
36 Baseboard Power Header Placement Relative to Processor Socket ................................. 105
37 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................. 106
38 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................. 106
39 Boxed Processor Fan Heatsink Set Points................................................................... 108
40 Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 111
41 Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 112
42 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ..... 113
43 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ..... 114
44 Assembly Stack Including the Support and Retention Module ....................................... 115
45 Boxed Processor TMA Power Cable Connector Description ............................................ 116
46 Balanced Technology Extended (BTX) Mainboard Power Header Placement
(hatched area) ...................................................................................................... 117
47 Boxed Processor TMA Set Points............................................................................... 119
Datasheet
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