X6800 Datasheet, PDF (111/122 Pages) Intel Corporation – Core2 Extreme Processor

Balanced Technology Extended (BTX) Boxed Processor Specifications
8 Balanced Technology Extended
(BTX) Boxed Processor
Specifications
The processor is offered as an Intel boxed processor. Intel boxed processors are
intended for system integrators who build systems from largely standard components.
The boxed processor will be supplied with a cooling solution known as the Thermal
Module Assembly (TMA). Each processor will be supplied with one of the two available
types of TMAs – Type I or Type II. This chapter documents motherboard and system
requirements for both the TMAs that will be supplied with the boxed processor in the
775-land LGA package. This chapter is particularly important for OEMs that
manufacture motherboards for system integrators. Figure 40 shows a mechanical
representation of a boxed processor in the 775-land LGA package with a Type I TMA.
Figure 41 illustrates a mechanical representation of a boxed processor in the 775-land
LGA package with Type II TMA.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets].
Note:
Figure 40.
Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the appropriate Thermal and Mechanical Design
Guidelines (see Section 1.2) for further guidance.
Mechanical Representation of the Boxed Processor with a Type I TMA
NOTE: The duct, clip, heatsink and fan can differ from this drawing representation but
the basic shape and size will remain the same.
Datasheet
111