X6800 Datasheet, PDF (118/122 Pages) Intel Corporation – Core2 Extreme Processor

Balanced Technology Extended (BTX) Boxed Processor Specifications
8.3
8.3.1
8.3.2
Note:
Thermal Specifications
This section describes the cooling requirements of the thermal module assembly
solution used by the boxed processor.
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a TMA. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
case temperature specification is listed in Chapter 6. The boxed processor TMA is able
to keep the processor temperature within the specifications (see Table 27) for chassis
that provide good thermal management. For the boxed processor TMA to operate
properly, it is critical that the airflow provided to the TMA is unimpeded. Airflow of the
TMA is into the duct and out of the rear of the duct in a linear flow. Blocking the airflow
to the TMA inlet reduces the cooling efficiency and decreases fan life. Filters will reduce
or impede airflow which will result in a reduced performance of the TMA. The air
temperature entering the fan should be kept below 35.5 °C. Meeting the processor's
temperature specification is the responsibility of the system integrator.
In addition, Type I TMA must be used with Type I chassis only and Type II TMA with
Type II chassis only. Type I TMA will not fit in a Type II chassis due to the height
difference. In the event a Type II TMA is installed in a Type I chassis, the gasket on the
chassis will not seal against the Type II TMA and poor acoustic performance will occur
as a result.
Variable Speed Fan
The boxed processor fan operates at different speeds over a short range of
temperatures based on a thermistor located in the fan hub area. This allows the boxed
processor fan to operate at a lower speed and noise level while thermistor
temperatures are low. If the thermistor senses a temperatures increase beyond a lower
set point, the fan speed will rise linearly with the temperature until the higher set point
is reached. At that point, the fan speed is at its maximum. As fan speed increases, so
do fan noise levels. These set points are represented in Figure 47 and Table 41. The
internal chassis temperature should be kept below 35.5 ºC. Meeting the processor’s
temperature specification (see Chapter 5) is the responsibility of the system integrator.
The motherboard must supply a constant +12 V to the processor’s power header to
ensure proper operation of the variable speed fan for the boxed processor (refer to
Table 41) for the specific requirements).
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Datasheet