X6800 Datasheet, PDF (4/122 Pages) Intel Corporation – Core2 Extreme Processor

5.2.5 THERMTRIP# Signal ................................................................................89
5.3 Thermal Diode...................................................................................................90
5.4 Platform Environment Control Interface (PECI) ......................................................92
5.4.1 Introduction ...........................................................................................92
5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management .......92
5.4.2 PECI Specifications .................................................................................94
5.4.2.1 PECI Device Address..................................................................94
5.4.2.2 PECI Command Support .............................................................94
5.4.2.3 PECI Fault Handling Requirements ...............................................94
5.4.2.4 PECI GetTemp0() Error Code Support ..........................................94
6 Features ..................................................................................................................95
6.1 Power-On Configuration Options ..........................................................................95
6.2 Clock Control and Low Power States .....................................................................95
6.2.1 Normal State .........................................................................................96
6.2.2 HALT and Extended HALT Powerdown States ..............................................96
6.2.2.1 HALT Powerdown State ..............................................................96
6.2.2.2 Extended HALT Powerdown State ................................................97
6.2.3 Stop Grant and Extended Stop Grant States ...............................................97
6.2.3.1 Stop Grant State .......................................................................97
6.2.3.2 Extended Stop Grant State .........................................................98
6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop
State, and Stop Grant Snoop State ...........................................................98
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................98
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......98
6.3 Enhanced Intel^® SpeedStep^® Technology .............................................................98
7 Boxed Processor Specifications.............................................................................. 101
7.1 Mechanical Specifications .................................................................................. 102
7.1.1 Boxed Processor Cooling Solution Dimensions........................................... 102
7.1.2 Boxed Processor Fan Heatsink Weight ..................................................... 103
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip
Assembly............................................................................................. 103
7.2 Electrical Requirements .................................................................................... 103
7.2.1 Fan Heatsink Power Supply .................................................................... 103
7.3 Thermal Specifications...................................................................................... 105
7.3.1 Boxed Processor Cooling Requirements.................................................... 105
7.3.2 Fan Speed Control Operation (Intel^® Core2 Extreme Processor
X6800 Only) ........................................................................................ 107
7.3.3 Fan Speed Control Operation (Intel^® Core2 Duo Desktop Processor
E6000 and E4000 Sequences Only) ......................................................... 107
8 Balanced Technology Extended (BTX) Boxed Processor Specifications ................... 111
8.1 Mechanical Specifications .................................................................................. 112
8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor
Cooling Solution Dimensions .................................................................. 112
8.1.2 Boxed Processor Thermal Module Assembly Weight ................................... 114
8.1.3 Boxed Processor Support and Retention Module (SRM) .............................. 115
8.2 Electrical Requirements .................................................................................... 116
8.2.1 Thermal Module Assembly Power Supply .................................................. 116
8.3 Thermal Specifications...................................................................................... 118
8.3.1 Boxed Processor Cooling Requirements.................................................... 118
8.3.2 Variable Speed Fan ............................................................................... 118
9 Debug Tools Specifications .................................................................................... 121
9.1 Logic Analyzer Interface (LAI) ........................................................................... 121
9.1.1 Mechanical Considerations ..................................................................... 121
9.1.2 Electrical Considerations ........................................................................ 121
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Datasheet