TLE6266G Datasheet, PDF (48/50 Pages) Infineon Technologies AG – System Basis Chip

11
Package Outlines
P-DSO-28-6
(Plastic Dual Small Outline Package)
Target Datasheet TLE 6266
Figure 24 The P-DSO-28-6 package
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
Version 1.06
49
Dimensions in mm
2002-11-26