TC1797_14 Datasheet, PDF (187/192 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller

5.4
Package and Reliability
TC1797
Electrical Parameters
5.4.1 Package Parameters
Table 33 Thermal Characteristics of the Package
Device
Package
RΘJCT¹⁾ RΘJCB¹⁾ Unit
Note
TC1797 P/PG-BGA-416-10 /
4
6
K/W
P/PG-BGA-416-27
1) The top and bottom thermal resistances between the case and the ambient (R_TCAT, R_TCAB) are to be combined
with the thermal resistances between the junction and the case given above (R_TJCT, R_TJCB), in order to
calculate the total thermal resistance between the junction and the ambient (R_TJA). The thermal resistances
between the case and the ambient (R_TCAT, R_TCAB) depend on the external system (PCB, case) characteristics,
and are under user responsibility.
The junction temperature can be calculated using the following equation: T_J = T_A + R_TJA × P_D, where the R_TJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R_TJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ‘cold plate method’ (MIL SPEC-883 Method 1012.1).
Data Sheet
183
V1.3, 2014-08