CA91L8260B Datasheet, PDF (393/439 Pages) Integrated Device Technology – PowerSpan II™ User Manual

14. Package Information
393
14.2.2
Dual PCI 480 HSBGA Package
The thermal characteristics for the 480 package are based on the parameters in Table 95.
Table 95: Thermal Parameters
Package Conditions
Package type
Package size
Pitch
Pad size
Chip size
Substrate (layers)
Substrate thickness
HSBGA 480L
37.5 x 37.5 x 2.33 mm³
1.27 mm
303 x 303 mil²
253 x 253 mil²
4 Layer
0.56 mm
PCB Conditions (JEDEC JESD51-7)
PCB Layers
PCB dimensions
PCB thickness
4 Layer
101.6 x 114.3 mm
1.6 mm
Simulation Conditions
Power dissipation
Ambient temperature
3.0 watts
85 C
Table 96 shows the thermal characterization parameters from junction-to-top center (_JT) and the
thermal resistance from junction to case for the 480 package. These values are based on the parameters
described in Table 95.
Table 96: 480 PBGA Package Performance
Theta ja (C/W)
0 m/s
15.1
1 m/s
13.2
2 m/s
11.8
Psi_jt (C/W)
4.87
Theta jc (C/W)
6.00
Integrated Device Technology
www.idt.com
PowerSpan II User Manual
80A1010_MA001_09