PXD20 Datasheet, PDF (67/130 Pages) Freescale Semiconductor, Inc – PXD20 Microcontroller

Electrical characteristics
Table 12. Thermal characteristics for 176-pin LQFP¹ (continued)
Symbol
C
Parameter
Conditions
Value Unit SpecID
_JT
CC D Junction to Package Top Natural Convec-
tion⁵
2
°C/W
D3.7
1 _{Thermal characteristics are targets based on simulation that are subject to change per device characterization.}
2 _{Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets}
JEDEC specification for this package.
3 _{Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for}
the specified package.
4 _{Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used}
for the case temperature. Reported value includes the thermal resistance of the interface layer.
5 _{Thermal characterization parameter indicating the temperature difference between the package top and the junction}
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
Table 13. Thermal characteristics for 208-pin LQFP¹
Symbol
C
Parameter
Conditions
Value Unit SpecID
R_JA
R_JA
R_JMA
R_JMA
R_JB
R_JCtop
_JT
CC D Junction to Ambient Natural Convection² Single layer board –1s
34
CC D Junction to Ambient Natural Convection² Four layer board –2s2p
27
CC D Junction to Ambient²
@200 ft./min., single layer 27
board –1s
CC D Junction to Ambient²
@200 ft./min., Four layer 22
board –2s2p
CC D Junction to Board³
—
18
CC D Junction to Case (Top)⁴
—
5
CC D Junction to Package Top Natural Convec-
—
2
tion⁵
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
D3.8
D3.9
D3.10
D3.11
D3.12
D3.13
D3.14
1 _{Thermal characteristics are targets based on simulation that are subject to change per device characterization.}
2 _{Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets JEDEC}
specification for this package.
3 _{Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for}
the specified package.
4 _{Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used}
for the case temperature. Reported value includes the thermal resistance of the interface layer.
5 _{Thermal characterization parameter indicating the temperature difference between the package top and the junction}
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as
Psi-JT.
Table 14. Thermal characteristics for 416-pin TEPBGA¹
Symbol
R_JA
CC
R_JA
CC
R_JMA
CC
C
Parameter
D Junction to Ambient Natural Convection²
D Junction to Ambient Natural Convection²
D Junction to Ambient²
R_JMA
CC D Junction to Ambient²
R_JB
R_JCtop
CC D Junction to Board³
CC D Junction to Case (Top)⁴
Conditions
Value
Single layer board –1s
26
Four layer board –2s2p
18
@200 ft./min., single layer 20
board –1s
@200 ft./min., Four layer 15
board –2s2p
—
10
—
6
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
SpecID
D3.15
D3.16
D3.17
D3.18
D3.19
D3.20
PXD20 Microcontroller Data Sheet, Rev. 2
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
67